Server Liquid Cooling Module

Server Liquid Cooling Module is designed for high-efficiency thermal management in servers and high-density computing systems. By enabling direct thermal contact between the coolant path and key heat-generating chips, the module delivers significantly higher heat dissipation performance than conventional air cooling while helping reduce PUE, noise, dust and vibration in data center environments.

This product line includes liquid cooling solutions for both CPU and GPU applications. CPU cold plates are available for mainstream processor platforms, while GPU cold plate solutions can be developed according to PCIe or SXM thermal design requirements. Customized configurations are available to support different server architectures and customer-specific cooling needs.

Key Features

• Designed for server CPU and GPU liquid cooling applications
• Direct-contact liquid cooling for improved heat transfer efficiency
• Helps reduce PUE compared with traditional air cooling solutions
• Supports lower noise, less dust and reduced vibration in operation
• Engineering simulation support during the design stage
• Thermal, flow and structural strength analysis available
• High-efficiency and low-resistance flow path design
• Supports high heat flux cooling performance
• Reliable long-term operation with strict validation testing
• Custom development available for different CPU and GPU platforms

Applications

• Liquid-cooled servers
• High-density data centers
• AI and GPU computing platforms
• HPC systems
• Customized server thermal management projects

Note: Product structure and interface design may vary depending on CPU platform, GPU form factor and project-specific cooling requirements.